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d a t a sh eet product speci?cation file under integrated circuits, ic01 november 1982 integrated circuits TDA1010a 6 w audio power amplifier in car applications 10 w audio power amplifier in mains-fed applications
november 1982 2 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed TDA1010a the TDA1010a is a monolithic integrated class-b audio amplifier circuit in a 9-lead single in-line (sil) plastic package. the device is primarily developed as a 6 w car radio amplifier for use with 4 w and 2 w load impedances. the wide supply voltage range and the flexibility of the ic make it an attractive proposition for record players and tape recorders with output powers up to 10 w. special features are: single in-line (sil) construction for easy mounting separated preamplifier and power amplifier high output power low-cost external components good ripple rejection thermal protection quick reference data package outline 9-lead sil; plastic (sot110b); sot110-1; 1996 sepetember 06. supply voltage range v p 6 to 24 v repetitive peak output current i orm max. 3 a output power at pin 2; d tot = 10% v p = 14,4 v; r l = 2 w p o typ. 6,4 w v p = 14,4 v; r l = 4 w p o typ. 6,2 w v p = 14,4 v; r l = 8 w p o typ. 3,4 w v p = 14,4 v; r l = 2 w ; with additional bootstrap resistor of 220 w between pins 3 and 4 p o typ. 9 w total harmonic distortion at p o = 1 w; r l = 4 w d tot typ. 0,2 % input impedance preamplifier (pin 8) ? z i ? typ. 30 k w power amplifier (pin 6) ? z i ? typ. 20 k w total quiescent current at v p = 14,4 v i tot typ. 31 ma sensitivity for p o = 5,8 w; r l = 4 w v i typ. 10 mv operating ambient temperature t amb - 25 to + 150 c storage temperature t stg - 55 to + 150 c
november 1982 3 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.1 circuit diagram.
november 1982 4 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a ratings limiting values in accordance with the absolute maximum system (iec 134) heatsink design assume v p = 14,4 v; r l = 2 w ; t amb = 60 c maximum; thermal shut-down starts at t j = 150 c. the maximum sine-wave dissipation in a 2 w load is about 5,2 w. the maximum dissipation for music drive will be about 75% of the worst-case sine-wave dissipation, so this will be 3,9 w. consequently, the total resistance from junction to ambient . since r th j-tab = 10 k/w and r th tab-h = 1 k/w, r th h-a = 23 - (10 + 1) = 12 k/w. supply voltage v p max. 24 v peak output current i om max. 5 a repetitive peak output current i orm max. 3 a total power dissipation see derating curve fig.2 storage temperature t stg - 55 to +150 c operating ambient temperature t amb - 25 to +150 c a.c. short-circuit duration of load during sine-wave drive; without heatsink at v p = 14,4 v t sc max. 100 hours fig.2 power derating curve. r th j-a r th j-tab = r th tab-h r th h-a ++ 150 60 C 39 , ---------------------- 23 k/w ==
november 1982 5 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a d.c. characteristics a.c. characteristics t amb = 25 c; v p = 14,4 v; r l = 4 w ; f = 1 khz unless otherwise speci?ed; see also fig.3. supply voltage range v p 6 to 24 v repetitive peak output current i orm <3a total quiescent current at v p = 14,4 v i tot typ. 31 ma a.f. output power (see fig.4) at d tot = 10%; measured at pin 2; with bootstrap v p = 14,4 v; r l = 2 w (note 1) p o typ. 6,4 w v p = 14,4 v; r l = 4 w (note 1 and 2) p o > 5,9 w typ. 6,2 w v p = 14,4 v; r l = 8 w (note 1) p o typ. 3,4 w v p = 14,4 v; r l = 4 w ; without bootstrap p o typ. 5,7 w v p = 14,4 v; r l = 2 w ; with additional bootstrap resistor of 220 w between pins 3 and 4 p o typ. 9 w voltage gain preamplifier (note 3) g v1 typ. 24 db 21 to 27 db power amplifier g v2 typ. 30 db 27 to 33 db total amplifier g v tot typ. 54 db 51 to 57 db total harmonic distortion at p o = 1 w d tot typ. 0,2 % ef?ciency at p o = 6 w h typ. 75 % frequency response ( - 3 db) b 80 hz to 15 khz input impedance preamplifier (note 4) ? z i ? typ. 30 k w 20 to 40 k w power amplifier (note 5) ? z i ? typ. 20 k w 14 to 26 k w output impedance of preampli?er; pin 7 (note 5) ? z o ? typ. 20 k w 14 to 26 k w output voltage preampli?er (r.m.s. value) d tot < 1% (pin 7) (note 3) v o(rms) > 0,7 v noise output voltage (r.m.s. value; note 6) r s = 0 w v n(rms) typ. 0,3 mv r s = 8,2 k w v n(rms) typ. 0,7 mv < 1,4 mv ripple rejection at f = 1 khz to 10 khz (note 7) rr > 42 db at f = 100 hz; c2 = 1 m f rr > 37 db sensitivity for p o = 5,8 w v i typ. 10 mv bootstrap current at onset of clipping; pin 4 (r.m.s. value) i 4(rms) typ. 30 ma
november 1982 6 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a notes 1. measured with an ideal coupling capacitor to the speaker load. 2. up to p o 3 w : d tot 1%. 3. measured with a load impedance of 20 k w . 4. independent of load impedance of preamplifier. 5. output impedance of preamplifier ( ? z o ? ) is correlated (within 10%) with the input impedance ( ? z i ? ) of the power amplifier. 6. unweighted r.m.s. noise voltage measured at a bandwidth of 60 hz to 15 khz (12 db/octave). 7. ripple rejection measured with a source impedance between 0 and 2 k w (maximum ripple amplitude: 2 v). 8. the tab must be electrically floating or connected to the substrate (pin 9). fig.3 test circuit.
november 1982 7 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig. 5 see next page. total harmonic distortion in the circuit of fig.3 as a function of the output power with the load impedance as a parameter; typical values. solid lines indicate the power across the load, dashed lines that available at pin 2 of the TDA1010. r l = 2 w (1) has been measured with an additional 220 w bootstrap resistor between pins 3 and 4. measurements were made at f = 1 khz, v p = 14,4 v. fig.4 output power of the circuit of fig.3 as a function of the supply voltage with the load impedance as a parameter; typical values. solid lines indicate the power across the load, dashed lines that available at pin 2 of the TDA1010. r l = 2 w (1) has been measured with an additional 220 w bootstrap resistor between pins 3 and 4. measurements were made at f = 1 khz, d tot = 10%, t amb = 25 c.
november 1982 8 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.5 for caption see preceding page. fig.6 frequency characteristics of the circuit of fig.3 for three values of load impedance; typical values. p o relative to 0 db = 1 w; v p = 14,4 v.
november 1982 9 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.7 total power dissipation (solid lines) and the efficiency (dashed lines) of the circuit of fig.3 as a function of the output power with the load impedance as a parameter (for r l = 2 w an external bootstrap resistor of 220 w has been used); typical values. v p = 14,4 v; f = 1 khz.
november 1982 10 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.8 thermal resistance from heatsink to ambient of a 1,5 mm thick bright aluminium heatsink as a function of the single-sided area of the heatsink with the total power dissipation as a parameter.
november 1982 11 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a application information fig.9 complete mono audio amplifier of a car radio.
november 1982 12 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.10 track side of printed-circuit board used for the circuit of fig.9; p.c. board dimensions 92 mm 52 mm. fig.11 component side of printed-circuit board showing component layout used for the circuit of fig.9.
november 1982 13 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.12 complete stereo car radio amplifier.
november 1982 14 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.13 track side of printed-circuit board used for the circuit of fig.12; p.c. board dimensions 83 mm 65 mm.
november 1982 15 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.14 component side of printed-circuit board showing component layout used for the circuit of fig.12. balance control is not on the p.c. board.
november 1982 16 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.15 channel separation of the circuit of fig.12 as a function of the frequency. fig.16 power supply of circuit of fig.17.
november 1982 17 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.17 complete mains-fed ceramic stereo pick-up amplifier; for power supply see fig.16.
november 1982 18 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.18 track side of printed-circuit board used for the circuit of fig.17 (fig.16 partly); p.c. board dimensions 169 mm 118 mm.
november 1982 19 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.19 component side of printed-circuit board showing component layout used for the circuit of fig.17 (fig.16 partly).
november 1982 20 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a fig.20 channel separation of the circuit of fig.18 as a function of frequency.
november 1982 21 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications 10 w audio power ampli?er in mains-fed applications TDA1010a package outline unit a a max. 2 a 3 b 1 d 1 b 2 bcd (1) e (1) z max. (1) elpp 1 q 1 q 2 q references outline version european projection issue date iec jedec eiaj mm 18.5 17.8 3.7 8.7 8.0 a 4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1.0 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 q 1.75 1.55 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 sot110-1 92-11-17 95-02-25 0 5 10 mm scale 0.25 w d e a a c a 2 3 a 4 q 1 q 2 l q w m b b 1 b 2 d 1 p q 1 z e 19 p seating plane pin 1 index sil9mpf: plastic single in-line medium power package with fin; 9 leads sot110-1
november 1982 22 philips semiconductors product speci?cation 6 w audio power ampli?er in car applications TDA1010a soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). soldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. repairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.

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